功率半导体模块用陶瓷覆铜板（英文版）
Ceramic copper-clad substrate for power semiconductor modules
标准状态
发布于：2026-08-28
实施于：2027-03-01
废止
基本信息
GB/T 48118-2026
即将实施
2026-08-28
2027-03-01
China Building Materials Federation
State Administration for Market Regulation and Standardization Administration of China
National Technical Committee 194 on Industrial Ceramics of Standardization Administration of China (SAC/TC 194)
China Building Materials Federation
国检测试控股集团淄博有限公司; 中国国检测试控股集团山东有限公司; 淄博职业技术大学; 淄博市临淄银河高技术开发有限公司; 浙光电子（嘉兴）有限公司; 浙江东瓷科技有限公司; 郑州中瓷科技有限公司; 宜宾红星电子有限公司; 山东工业陶瓷研究设计院有限公司; 中材高新氮化物陶瓷有限公司; 深圳市博敏电子有限公司; 山东国瓷功能材料股份有限公司; 成都万士达瓷业有限公司; 中国电子科技集团公司第十二研究所; 浙江德汇电子陶瓷有限公司; 江西五阳新材料有限公司; 景德镇奈创陶瓷材料有限公司; 山东理工大学; 上海电子信息职业技术学院; 深圳市祺利电子有限公司; 江苏博睿光电股份有限公司; 上海微谱检测科技集团股份有限公司
LI Kai, WU Ping, GENG Dianguo, LI Lei, CHEN Yang, DUAN Mingxin, LIN Guihong, SHEN Yizhou, SUN Feng, ZHOU Wei, SHANG Aman, LI Haiqing, MENG Haitao, ZHAO Jing, SONG Ke, CHEN Changzhu, WANG Qiang, MO Xuekui, HUANG Shidong, LIANG Chao, ZHANG Jidong, CHEN Junjiao, ZHANG Hui, XIAO Weifeng, HONG Xiucui, YANG Baosheng, WANG Zaiyi, KONG Hui, XIA Weiliang, LI Jie, YUAN Jing, LIU Mei, YUAN Kun, SU Tao, MU Yufeng, WANG Guosheng, ZHOU Li, XIE Shihui and YIN Fengshi
标准简介
This document specifies the classification and marking, technical requirements, test methods, inspection rules, and marking, packaging, transport and storage of ceramic copper-clad substrates for power semiconductors produced by the direct bonded copper process ("DBC"). This document is applicable to DBC ceramic copper-clad substrates for power semiconductors such as resistor substrates, semiconductor refrigeration devices, integrated circuits, power modules and micro-motors; ceramic copper-clad substrates made by other copper cladding processes may refer to it.
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