半导体器件的机械标准化 第6-3部分：表面安装半导体器件封装外形图绘制的一般规则 四边扁平封装（QFP）的尺寸测量方法

Mechanical standardization of semiconductor devices—Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of quad flat packs (QFP)