半导体器件的机械标准化 第6-12部分：表面安装半导体器件封装外形图绘制的一般规则 密节距焊盘阵列封装（FLGA）的设计指南

Mechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)